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hi3611rbc121 bga encapsulated cpu chip smart phone chip brand new in stock consult before shooting

HI3611RBC121 BGA封装 CPU芯片智能手机芯片 全新现货 先询后拍

  • EXW Price: Min. order:
    USD $2.62
    ≥2/piece
  • 2 piece
  • Weight 0.2 kg/piece
  • Item No. 871936769028
  • specification model
  • Specifications
    Specifications Stock Quantity
    hi3611rbc121(HI3611RBC121) USD $0.0 15662 piece available
    Summary 0 piece Subtotal:USD $ 0 Selected ∧
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  • Description

Packaging information

CTN Size: 80 × 40 × 50 cm

G.W./CTN:28 kg

QTY/CTN:600 piece/carton

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Update time:20260412150150


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