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HI3611RBC121 BGA封装 CPU芯片智能手机芯片 全新现货 先询后拍
| hi3611rbc121(HI3611RBC121) | USD $0.0 | 15662 piece available |
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Packaging information
CTN Size: 80 × 40 × 50 cm
G.W./CTN:28 kg
QTY/CTN:600 piece/carton





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