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size diameter brass wafer customized 0.8-10.0mm brass plate laser cutting hollow punching processing

size diameter brass wafer customized 0.8-10.0mm brass plate laser cutting hollow punching processing

大小直径黄铜圆片定做 0.8-10.0mm黄铜板激光切割镂空打孔加工

  • EXW Price: Min. order:
    USD $0.23
    ≥1/piece
    • 1 piece
  • Weight 0.2 kg/piece
  • Item No. 589160119775
  • Stock num 99962142 piece
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  • Description

Packaging information

CTN Size: 80 × 40 × 50 cm

G.W./CTN:28 kg

QTY/CTN:600 piece/carton

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Update time：20250714120114


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