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h59h62 brass wafer 0.2-10mm round copper board thin gasket circle laser cutting brushed carving letter processing

H59H62黄铜圆片0.2-10mm圆形铜板薄垫片圈激光切割拉丝雕刻字加工

  • EXW Price:
    From: USD $0.23
    Min. order: 1 piece
  • 1 piece
  • Weight 0.2 kg/piece
  • Item No. 784791465284
  • product specifications
  • Specifications
    Specifications Price(RMB) Stock Quantity
    custom processing(来图来样定制加工) USD $0.23 93181 piece available
    laser marking pattern logo lettering processing(激光镭射打标图案Logo刻字加工) USD $0.23 99918 piece available
    sample surface color plating oil injection silk screen printing processing(表面抛光镀色喷油丝印加工) USD $0.23 96994 piece available
    surface carving corrosion pattern text processing(表面雕刻腐蚀图案文字加工) USD $0.23 99994 piece available
    wafer drilling and tapping(圆片打孔攻丝溜光加工) USD $0.23 99995 piece available
    for more specifications, please consult customer service for quotation.(更多规格请咨询客服报价) USD $0.23 97000 piece available
    Summary 0 piece Subtotal:USD $ 0 Selected ∧
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  • Description

Packaging information

CTN Size: 80 × 40 × 50 cm

G.W./CTN:28 kg

QTY/CTN:600 piece/carton

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Update time:20250714120114


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